Manufacturing

We invest in the latest state-of-art equipment to enhance our manufacturing capabilities.

Our process capabilities include :-

• SMT/PTH/Radial/Axial
• 0402/0201 Chip Mounting
• BGA/COB/CSP Assembly
• On-Line AOI
• Selective Wave soldering process
• Lead-free soldering process
• Conformal Coating
• ICT / FCT Software Development
• CDMA & GSM Testing
• Box-Build / Complete System
• Burn-In
• Equipment & System Integration
• On-Line ERP System

PCB Assembly

We offer a full solution for all PCB Assembly and testing requirements. We use the latest technology in both the manufacturing and the testing of complex printed circuit boards. Our programs include product applications in the high-end video and audio product, telecommunications, networking, optical, and high-end computer systems markets. We focus on time-to-market and on providing the most cost effective solution. Our global manufacturing and engineering staff is available to support your design, prototype and production requirements. With our existing facilities, we can provide a scalable manufacturing solution tailored to specific product and logistic demands.

Box-build Assembly

We have close working relationships with key commodity suppliers to assure success in box-build assembly.

• Strategic relationship with plastic, casting, stamping, flex circuits, cable harness, connectors and IC component suppliers
• Concurrent and Value Engineering
• System Integration
• Retail Packaging

Equipment & System Integration

This is a newly set up division of equipment and systems integration for assembly. We build, assemble and test equipment and systems to serve our new customers in this semiconductor industry. We also provide turnkey business for our customers.